Niklaus, Frank: search on Z-Library

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1

Scalable manufacturing of single nanowire devices using crack-defined shadow mask lithography

Enrico, Alessandro, Dubois, Valentin, Niklaus, Frank, Stemme, Göran

Journal:

ACS Applied Materials & Interfaces

Year:

2019

Language:

english

File:

PDF, 3.12 MB

english, 2019

2

Wafer bonding with nano-imprint resists as sacrificial adhesive for fabrication of silicon-on-integrated-circuit (SOIC) wafers in 3D integration of MEMS and ICs

Frank Niklaus, Adit Decharat, Fredrik Forsberg, Niclas Roxhed, Martin Lapisa, Michael Populin, Fabian Zimmer, Jörn Lemm, Göran Stemme

Journal:

Sensors and Actuators A: Physical

Year:

2009

Language:

english

File:

PDF, 894 KB

english, 2009

3

SPIE Proceedings [SPIE Photonics Asia 2007 - Beijing, China (Sunday 11 November 2007)] MEMS/MOEMS Technologies and Applications III - MEMS-based uncooled infrared bolometer arrays: a review

Niklaus, Frank, Vieider, Christian, Jakobsen, Henrik, Chiao, Jung-Chih, Chen, Xuyuan, Zhou, Zhaoying, Li, Xinxin

Year:

2007

Language:

english

File:

PDF, 620 KB

english, 2007

4

SPIE Proceedings [SPIE Defense and Security Symposium - Orlando, FL (Monday 9 April 2007)] Infrared Technology and Applications XXXIII - Uncooled infrared bolometer arrays operating in a low to medium vacuum atmosphere: performance model and tradeoffs

Niklaus, Frank, Jansson, Christer, Decharat, Adit, Källhammer, Jan-Erik, Pettersson, Håkan, Stemme, Göran, Andresen, Bjørn F., Fulop, Gabor F., Norton, Paul R.

Year:

2007

Language:

english

File:

PDF, 700 KB

english, 2007

5

Performance model for uncooled infrared bolometer arrays and performance predictions of bolometers operating at atmospheric pressure

Frank Niklaus, Adit Decharat, Christer Jansson, Göran Stemme

Journal:

Infrared Physics & Technology

Year:

2008

Language:

english

File:

PDF, 644 KB

english, 2008

6

Through Silicon Vias With Invar Metal Conductor for High-Temperature Applications

Asiatici, Mikhail, Laakso, Miku J., Fischer, Andreas C., Stemme, Goran, Niklaus, Frank

Journal:

Journal of Microelectromechanical Systems

Year:

2017

Language:

english

File:

PDF, 4.31 MB

english, 2017

7

One-Megapixel Monocrystalline-Silicon Micromirror Array on CMOS Driving Electronics Manufactured With Very Large-Scale Heterogeneous Integration

Zimmer, Fabian, Lapisa, Martin, Bakke, Thor, Bring, Martin, Stemme, Göran, Niklaus, Frank

Journal:

Journal of Microelectromechanical Systems

Year:

2011

Language:

english

File:

PDF, 1.09 MB

english, 2011

8

Low-temperature full wafer adhesive bonding

Niklaus, Frank, Enoksson, Peter, Kälvesten, Edvard, Stemme, Göran

Journal:

Journal of Micromechanics and Microengineering

Year:

2001

Language:

english

File:

PDF, 327 KB

english, 2001

9

Drift-Free Micromirror Arrays Made of Monocrystalline Silicon for Adaptive Optics Applications

Lapisa, Martin, Zimmer, Fabian, Stemme, Göran, Gehner, Andreas, Niklaus, Frank

Journal:

Journal of Microelectromechanical Systems

Year:

2012

Language:

english

File:

PDF, 1.79 MB

english, 2012

10

Tracking litter-derived dissolved organic matter along a soil chronosequence using 14C imaging: Biodegradation, physico-chemical retention or preferential flow?

Hagedorn, Frank, Bruderhofer, Nadia, Ferrari, Adele, Niklaus, Pascal A.

Journal:

Soil Biology and Biochemistry

Year:

2015

Language:

english

File:

PDF, 2.19 MB

english, 2015

11

Integrating MEMS and ICs

Fischer, Andreas C., Forsberg, Fredrik, Lapisa, Martin, Bleiker, Simon J., Stemme, Göran, Roxhed, Niclas, Niklaus, Frank

Journal:

Microsystems & Nanoengineering

Year:

2015

Language:

english

File:

PDF, 9.04 MB

english, 2015

12

Very large scale heterogeneous integration (VLSHI) and wafer-level vacuum packaging for infrared bolometer focal plane arrays

Forsberg, Fredrik, Roxhed, Niclas, Fischer, Andreas C., Samel, Björn, Ericsson, Per, Hoivik, Nils, Lapadatu, Adriana, Bring, Martin, Kittilsland, Gjermund, Stemme, Göran, Niklaus, Frank

Journal:

Infrared Physics & Technology

Year:

2013

Language:

english

File:

PDF, 1.75 MB

english, 2013

13

Quantitative assessment of structural and compositional colors induced by femtosecond laser: A case study on 301LN stainless steel surface

Shi, Xinying, Huang, Zhongjia, Laakso, Miku J., Niklaus, Frank, Sliz, Rafal, Fabritius, Tapio, Somani, Mahesh, Nyo, Tun, Wang, Xiao, Zhang, Meng, Wang, Gang, Kömi, Jukka, Huttula, Marko, Cao, Wei

Journal:

Applied Surface Science

Year:

2019

Language:

english

File:

PDF, 2.82 MB

english, 2019

14

Bactericidal surfaces prepared by femtosecond laser patterning and layer-by-layer polyelectrolyte coating

Chen, Chao, Enrico, Alessandro, Pettersson, TorbjÃ¶rn, Ek, Monica, Herland, Anna, Niklaus, Frank, Stemme, GÃ¶ran, WÃ¥gberg, Lars

Journal:

Journal of Colloid and Interface Science

Year:

2020

File:

PDF, 11.23 MB

2020

15

3D Free-Form Patterning of Silicon by Ion Implantation, Silicon Deposition, and Selective Silicon Etching

Andreas C. Fischer, Lyubov M. Belova, Yuri G. M. Rikers, B. Gunnar Malm, Henry H. Radamson, Mohammadreza Kolahdouz, Kristinn B. Gylfason, Göran Stemme, Frank Niklaus

Journal:

Advanced Functional Materials

Year:

2012

Language:

english

File:

PDF, 1.22 MB

english, 2012

16

[IEEE 2018 IEEE International Microwave Biomedical Conference (IMBioC) - Philadelphia, PA, USA (2018.6.14-2018.6.15)] 2018 IEEE International Microwave Biomedical Conference (IMBioC) - Initial In-Vitro Trial for Intra-Cranial Pressure Monitoring Using Subdermal Proximity-Coupled Split-Ring Resonator

Redzwan, Syaiful, Velander, Jacob, Perez, Mauricio D., Asan, Noor Badariah, Rajabi, Mina, Niklaus, Frank, Nowinski, Daniel, Lewen, Anders, Enblad, Per, Augustine, Robin

Year:

2018

Language:

english

File:

PDF, 438 KB

english, 2018

17

High-Aspect-Ratio Through Silicon Vias for High-Frequency Application Fabricated by Magnetic Assembly of Gold-Coated Nickel Wires

Bleiker, Simon J., Fischer, Andreas C., Shah, Umer, Somjit, Nutapong, Haraldsson, Tommy, Roxhed, Niclas, Oberhammer, Joachim, Stemme, Goran, Niklaus, Frank

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2015

Language:

english

File:

PDF, 4.28 MB

english, 2015

18

Graphene-based CO 2 sensing and its cross-sensitivity with humidity

Smith, Anderson D., Elgammal, Karim, Fan, Xuge, Lemme, Max C., Delin, Anna, Råsander, Mikael, Bergqvist, Lars, Schröder, Stephan, Fischer, Andreas C., Niklaus, Frank, Östling, Mikael

Journal:

Year:

2017

Language:

english

File:

PDF, 1.10 MB

english, 2017

19

Resistive Graphene Humidity Sensors with Rapid and Direct Electrical Readout

Smith, Anderson David, Elgammal, Karim, Niklaus, Frank, Delin, Anna, Fischer, Andreas, Vaziri, Sam, Forsberg, Fredrik, Råsander, Mikael, Hugosson, Håkan W., Bergqvist, Lars, Schröder, Stephan, Satende

Journal:

Year:

2015

Language:

english

File:

PDF, 2.22 MB

english, 2015

20

Cost-Efficient Wafer-Level Capping for MEMS and Imaging Sensors by Adhesive Wafer Bonding

Bleiker, Simon, Visser Taklo, Maaike, Lietaer, Nicolas, Vogl, Andreas, Bakke, Thor, Niklaus, Frank

Journal:

Year:

2016

Language:

english

File:

PDF, 3.99 MB

english, 2016

21

Increasing soil methane sink along a 120-year afforestation chronosequence is driven by soil moisture

David Hiltbrunner, Stephan Zimmermann, Saeed Karbin, Frank Hagedorn, Pascal A. Niklaus

Journal:

Global Change Biology

Year:

2012

Language:

english

File:

PDF, 589 KB

english, 2012

22

[IEEE Nanophotonics - Istanbul, Turkey (2011.08.8-2011.08.11)] 16th International Conference on Optical MEMS and Nanophotonics - High-performance infrared micro-bolometer arrays manufactured using very large scale heterogeneous integration

Forsberg, Fredrik, Fischer, Andreas C., Stemme, Goran, Roxhed, Niclas, Niklaus, Frank, Ericsson, Per, Samel, Bjorn

Year:

2011

Language:

english

File:

PDF, 1.34 MB

english, 2011

23

SPIE Proceedings [SPIE Defense and Security Symposium - Orlando, FL (Monday 9 April 2007)] Infrared Technology and Applications XXXIII - Low-cost far infrared bolometer camera for automotive use

Vieider, Christian, Wissmar, Stanley, Ericsson, Per, Halldin, Urban, Niklaus, Frank, Stemme, Göran, Källhammer, Jan-Erik, Pettersson, Håkan, Eriksson, Dick, Jakobsen, Henrik, Kvisterøy, Terje, Franks,

Year:

2007

Language:

english

File:

PDF, 417 KB

english, 2007

24

Wafer-Level Vacuum Sealing by Coining of Wire Bonded Gold Bumps

Antelius, Mikael, Fischer, Andreas C., Roxhed, Niclas, Stemme, Goran, Niklaus, Frank

Journal:

Journal of Microelectromechanical Systems

Year:

2013

Language:

english

File:

PDF, 4.40 MB

english, 2013

25

Special issue WaferBond’13

Knechtel, Roy, Niklaus, Frank, Michel, Bernd

Journal:

Microsystem Technologies

Year:

2015

Language:

english

File:

PDF, 152 KB

english, 2015

26

A method to maintain wafer alignment precision during adhesive wafer bonding

Frank Niklaus, Peter Enoksson, Edvard Kälvesten, Göran Stemme

Journal:

Sensors and Actuators A: Physical

Year:

2003

Language:

english

File:

PDF, 94 KB

english, 2003

27

Deconstruction, demolition and destruction

Thomsen, André, Schultmann, Frank, Kohler, Niklaus

Journal:

Building Research & Information

Year:

2011

Language:

english

File:

PDF, 187 KB

english, 2011

28

Phytophthora-ID.org: A Sequence-Based Phytophthora Identification Tool

Grünwald, Niklaus J., Martin, Frank N., Larsen, Meredith M., Sullivan, Christopher M., Press, Caroline M., Coffey, Michael D., Hansen, Everett M., Parke, Jennifer L.

Journal:

Year:

2011

Language:

english

File:

PDF, 533 KB

english, 2011

29

[IEEE 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) - Tokyo, Japan (2012.05.22-2012.05.23)] 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration - Wafer-level heterogeneous 3D integration for MEMS and NEMS

Niklaus, Frank, Lapisa, Martin, Bleiker, Simon J., Dubois, Valentin, Roxhed, Niclas, Fischer, Andreas C., Forsberg, Fredrik, Stemme, Goran, Grogg, Daniel, Despont, Michel

Year:

2012

Language:

english

File:

PDF, 3.63 MB

english, 2012

30

Graphene ribbons with suspended masses as transducers in ultra-small nanoelectromechanical accelerometers

Fan, Xuge, Forsberg, Fredrik, Smith, Anderson D., Schröder, Stephan, Wagner, Stefan, Rödjegård, Henrik, Fischer, Andreas C., Östling, Mikael, Lemme, Max C., Niklaus, Frank

Journal:

Nature Electronics

Year:

2019

Language:

english

File:

PDF, 1.78 MB

english, 2019

31

Wafer-Level Vacuum Packaging Enabled by Plastic Deformation and Low-Temperature Welding of Copper Sealing Rings With a Small Footprint

Wang, Xiaojing, Bleiker, Simon J., Antelius, Mikael, Stemme, Goran, Niklaus, Frank

Journal:

Journal of Microelectromechanical Systems

Year:

2017

Language:

english

File:

PDF, 3.96 MB

english, 2017

32

Massively parallel fabrication of crack-defined gold break junctions featuring sub-3 nm gaps for molecular devices

Dubois, Valentin, Raja, Shyamprasad N., Gehring, Pascal, Caneva, Sabina, van der Zant, Herre S. J., Niklaus, Frank, Stemme, Göran

Journal:

Nature Communications

Year:

2018

Language:

english

File:

PDF, 2.17 MB

english, 2018

33

Suspended Graphene Membranes with Attached Silicon Proof Masses as Piezoresistive Nanoelectromechanical Systems Accelerometers

Fan, Xuge, Forsberg, Fredrik, Smith, Anderson D., Schröder, Stephan, Wagner, Stefan, Östling, Mikael, Lemme, Max C., Niklaus, Frank

Journal:

Year:

2019

Language:

english

File:

PDF, 6.85 MB

english, 2019

34

Batch Transfer of Radially Expanded Die Arrays for Heterogeneous Integration Using Different Wafer Sizes

Forsberg, Fredrik, Roxhed, Niclas, Haraldsson, Tommy, Liu, Yitong, Stemme, Göran, Niklaus, Frank

Journal:

Journal of Microelectromechanical Systems

Year:

2012

Language:

english

File:

PDF, 1.16 MB

english, 2012

35

Wafer-level membrane transfer bonding of polycrystalline silicon bolometers for use in infrared focal plane arrays

Niklaus, Frank, Kälvesten, Edvard, Stemme, Göran

Journal:

Journal of Micromechanics and Microengineering

Year:

2001

Language:

english

File:

PDF, 283 KB

english, 2001

36

Predicting global change impacts on plant species’ distributions: Future challenges

Wilfried Thuiller, Cécile Albert, Miguel B. Araújo, Pam M. Berry, Mar Cabeza, Antoine Guisan, Thomas Hickler, Guy F. Midgley, James Paterson, Frank M. Schurr, Martin T. Sykes, Niklaus E. Zimmermann

Journal:

Perspectives in Plant Ecology, Evolution and Systematics

Year:

2008

Language:

english

File:

PDF, 437 KB

english, 2008

37

[IEEE 2013 IEEE 26th International Conference on Micro Electro Mechanical Systems (MEMS) - Taipei, Taiwan (2013.01.20-2013.01.24)] 2013 IEEE 26th International Conference on Micro Electro Mechanical Systems (MEMS) - Temporary wafer bonding and debonding by an electrochemically active polymer adhesive for 3D integration

Gatty, Hithesh K, Niklaus, Frank, Stemme, Goran, Roxhed, Niclas

Year:

2013

Language:

english

File:

PDF, 1.96 MB

english, 2013

38

Pressure sensors based on suspended graphene membranes

Smith, Anderson.D., Vaziri, Sam, Niklaus, Frank, Fischer, Andreas.C., Sterner, Mikael, Delin, Anna, Östling, Mikael, Lemme, Max.C.

Journal:

Solid-State Electronics

Year:

2013

Language:

english

File:

PDF, 1.71 MB

english, 2013

39

Frequency and Determinants of Using Pharmacological Enhancement in the Clinical Practice of In-Hospital Stroke Rehabilitation

Engelter, Stefan T., Urscheler, Niklaus, Baronti, Fabio, Vuadens, Philippe, Koch, Joachim, Frank, Matthias, Disserens, Karin, Jenni, Walter

Journal:

European Neurology

Year:

2012

Language:

english

File:

PDF, 349 KB

english, 2012

40

Heterogeneous 3D integration of hidden hinge micromirror arrays consisting of two layers of monocrystalline silicon

Lapisa, Martin, Zimmer, Fabian, Stemme, Göran, Gehner, Andreas, Niklaus, Frank

Journal:

Journal of Micromechanics and Microengineering

Year:

2013

Language:

english

File:

PDF, 291 KB

english, 2013

41

[IEEE 2010 IEEE 23rd International Conference on Micro Electro Mechanical Systems (MEMS) - Wanchai, Hong Kong, China (2010.01.24-2010.01.28)] 2010 IEEE 23rd International Conference on Micro Electro Mechanical Systems (MEMS) - Low-temperature CMOS-compatible 3D-integration of monocrystalline-silicon based PZT RF MEMS switch actuators on rf substrates

Saharil, Farizah, Wright, Robert V., Rantakari, Pekka, Kirby, Paul B., Vaha-Heikkila, Tauno, Niklaus, Frank, Stemme, Goran, Oberhammer, Joachim

Year:

2010

File:

PDF, 604 KB

2010

42

SPIE Proceedings [SPIE SPIE MOEMS-MEMS: Micro- and Nanofabrication - San Jose, CA (Saturday 24 January 2009)] MOEMS and Miniaturized Systems VIII - Fabrication of large-scale monocrystalline silicon micro-mirror arrays using adhesive wafer transfer bonding

Zimmer, Fabian, Dickensheets, David L., Schenk, Harald, Niklaus, Frank, Lapisa, Martin, Piyawattanametha, Wibool, Ludewig, Thomas, Bring, Martin, Friedrichs, Martin, Bakke, Thor, Schenk, Harald, van d

Year:

2009

Language:

english

File:

PDF, 960 KB

english, 2009

43

Direct observation of grain boundaries in graphene through vapor hydrofluoric acid (VHF) exposure

Fan, Xuge, Wagner, Stefan, Schädlich, Philip, Speck, Florian, Kataria, Satender, Haraldsson, Tommy, Seyller, Thomas, Lemme, Max C., Niklaus, Frank

Journal:

Science Advances

Year:

2018

Language:

english

File:

PDF, 1.31 MB

english, 2018

44

The Influence of Humidity on Contact Resistance in Graphene Devices

Quellmalz, Arne, Smith, Anderson D., Elgammal, Karim, Fan, Xuge, Delin, Anna, Östling, Mikael, Lemme, Max C., Gylfason, Kristinn, Niklaus, Frank

Journal:

ACS Applied Materials & Interfaces

Year:

2018

Language:

english

File:

PDF, 1.02 MB

english, 2018

45

[IEEE 2009 IEEE 22nd International Conference on Micro Electro Mechanical Systems (MEMS) - Sorrento, Italy (2009.01.25-2009.01.29)] 2009 IEEE 22nd International Conference on Micro Electro Mechanical Systems - CMOS-Integrable Piston-Type Micro-Mirror Array for Adaptive Optics Made of Mono-Crystalline Silicon using 3-D Integration

Lapisa, Martin, Zimmer, Fabian, Niklaus, Frank, Gehner, Andreas, Stemme, Goran

Year:

2009

Language:

english

File:

PDF, 3.64 MB

english, 2009

46

ECS Transactions [ECS 218th ECS Meeting - Las Vegas, NV (October 10 - October 15, 2010)] - (Invited) Adhesive Wafer Bonding, Applications and Trends

Year:

2010

Language:

english

File:

PDF, 613 KB

english, 2010

47

Nanoelectromechanical digital logic circuits using curved cantilever switches with amorphous-carbon-coated contacts

Ayala, Christopher L., Grogg, Daniel, Bazigos, Antonios, Bleiker, Simon J., Fernandez-Bolaños, Montserrat, Niklaus, Frank, Hagleitner, Christoph

Journal:

Solid-State Electronics

Year:

2015

Language:

english

File:

PDF, 1.98 MB

english, 2015

48

SPIE Proceedings [SPIE Aerospace/Defense Sensing, Simulation, and Controls - Orlando, FL (Monday 16 April 2001)] Infrared Technology and Applications XXVII - New concept for CMOS-compatible fabrication of uncooled infrared focal plane arrays using wafer-scale device transfer bonding

Niklaus, Frank, Kaelvesten, Edvard, Stemme, Goeran, Andresen, Bjorn F., Fulop, Gabor F., Strojnik, Marija

Year:

2001

Language:

english

File:

PDF, 467 KB

english, 2001

49

Corrigendum to “Quantitative assessment of structural and compositional colors induced by femtosecond laser: A case study on 301LN stainless steel surface” [Appl. Surf. Sci. 484 (2019) 655–662]

Shi, Xinying, Huang, Zhongjia, Laakso, Miku J., Niklaus, Frank, Sliz, Rafal, Fabritius, Tapio, Somani, Mahesh, Nyo, Tun, Wang, Xiao, Zhang, Meng, Wang, Gang, Kömi, Jukka, Huttula, Marko, Cao, Wei

Journal:

Applied Surface Science

Year:

2019

Language:

english

File:

PDF, 135 KB

english, 2019

50

Micromechanical Process Integration and Material Optimization for High Performance Silicon-Germanium Bolometers

Malm, Gunnar B., Kolahdouz, Mohammadreza, Forsberg, Fredrik, Roxhed, Niclas, Niklaus, Frank

Journal:

MRS Proceedings

Year:

2012

Language:

english

File:

PDF, 1.59 MB

english, 2012

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